Photonics Packaging Engineer | Lightmatter

Details

Posted: 09-May-23

Location: Mountain View, California

Type: Full Time

Categories:

Undecided

Job Function:

Engineer

Years of Experience:

5-10

Salary Details:

Base Compensation Range: $180,000- $225,000. In accordance with the Colorado, California and New York law, the range provided is Lightmatter’s reasonable estimate of the compensation for this role. Actual pay will be based on several factors including work experience, location and education.

Required Education:

Masters

Photonics Packaging Engineer

Lightmatter builds chips for artificial intelligence computing. Our architecture leverages unique properties of light to enable fast and efficient inference and training engines. If you’re a collaborative engineer or scientist who has a passion for innovation, solving challenging technical problems and doing impactful work like building the world’s first optical computers, consider joining the team at Lightmatter!

Strong fundamental understanding of Silicon photonics and various packaging technologies used in the optical industry. Proven experience in optical packaging technologies applied in either developing laser modules or various fiber attach connector schemes to photonic IC and corresponding requirements. Working knowledge of mechanical design processes and software tools such as CAD.

Responsibilities:

  • Drive packaging requirements for laser modules, fiber attach connection methods to Photonic IC from conceptualization to production.
  • Collaborate cross functionally across disciplines such as Silicon, photonics and packaging/system team to consolidate product and packaging technologies requirements and drive design and analysis of the module/package

**This is not a complete listing of the responsibilities. It’s a representation of the things you will be doing**

Requirements

  • 6 years and a Master’s degree; or a PhD with 3 years experience; or equivalent experience with background in Silicon Photonics, opto-mechanics, laser-material interaction
  • Experience in photonics numerical simulation such as device modeling and simulations including photonic devices/waveguides;
  • Deep understanding of photonic manufacturing processes and material, understanding optical devices measurement and calibration techniques
  • Knowledge of packaging thermals and mechanical consideration such as heat transfer, and mechanical strain and stress. Ability to establish key interaction of photonic devices and package technology interaction; suggest methods to resolve and drive solutions.
  • In depth knowledge of Mechanical design processes and software experience using CAD/Solidworks.
  • Working knowing of various 2D/2.5D/3D packaging technologies.
  • Exposure to quality and reliability requirements for optical components.

Preferred Qualifications

  • Qualifications: MS or Ph.D Degree in Electrical, Mechanical Engineering or Physics, with a focus on photonics or semiconductor packaging
  • At least 6 years of experience in a photonics packaging role or related field
  • Proficiency with 3D CAD software (SolidWorks, AutoCAD)
  • Experience with statistical analysis and experimental design methodologies
  • Excellent written, oral, and interpersonal communication skills
  • Independence and capability of working well in a fast-paced, team-oriented environment
  • Proficiency in rigorous documentation and standard operating procedures (SOPs)
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About Lightmatter

Lightmatter builds chips for artificial intelligence computing. Our architecture leverages unique properties of light to enable fast and efficient inference and training engines. If you’re a collaborative engineer or scientist who has a passion for innovation, solving challenging technical problems and doing impactful work like building the world’s first optical computers, consider joining the team at Lightmatter!

Connections working at Lightmatter

Apply Here: https://jobs.workinoptics.com/jobs/rss/18558003/photonics-packaging-engineer