Sr Optoelectronic Development Engineer

KYOCERA SLD Laser, Inc., Goleta, CA, United StatesEmployer Description

SLD Laser, a world leader in commercialization of gallium nitride (GaN) based laser light sources, was acquired by KYOCERA Corporation and has commenced operations as a wholly owned subsidiary and group company of KYOCERA Corporation under the name KYOCERA SLD Laser, Inc. (KSLD). KSLD is commercializing a new generation of gallium nitride-based laser light sources. KSLD’s high luminance LaserLightTM sources are utilized in a myriad of applications including automotive & mobility, specialty & portable lighting, entertainment & outdoor, projection & AR/VR displays, biomedical instrumentation & therapeutics, and industrial imaging & material processing. 

The company is ISO 9001 certified and automotive compliant to IATF 16949, and operates facilities in Santa Barbara, CA and in Fremont, CA. KSLD’s high luminance LaserLightTM sources are UL and IEC safety certified. The company was recently ranked 7th in Fortune magazine’s “2021 Best Workplaces in Manufacturing & ProductionTM,” having promoted an employee-centric corporate culture since its founding. 

KSLD will continue to pioneer the future of light by developing, manufacturing and marketing innovative laser-based products with high efficiency and luminance for mobility, specialty lighting, consumer, and industrial applications.

To learn more about KSLD, visit or contact the company at [email protected] or 1-866-753-5273.

Job Description

KSLD Laser is looking to expand its product development team in Goleta, CA with a Sr Optoelectronic Development Engineer. The position will be responsible for developing new technology and new products in the innovative LaserLight SMD product family, with focus on mechanical/thermal/optical/electrical package design and assembly solutions compatible with high volume manufacturing.

Role & Responsibilities

  • Optical/Mechanical/thermal/electrical design of high-power optoelectronic packages and modules. Depending on the skill set of the candidate, he/she may drive parts or all aspects of the design.
  • Select technology and processes, define manufacturing equipment
  • Design for manufacturing; Create designs and utilize processes that are compatible with low-cost high-volume manufacturing technology.
  • Design for reliability; Work closely with reliability and validation engineers to create designs and select materials that are compatible with long lifetime and environmental robustness.
  • Support sample and pre-production builds with process development, technology transfer, in-depth analysis of large data sets, failure analysis.
  • Identify and work with suppliers of materials and equipment.
  • Drive projects to meet milestones on-time, by setting priorities and organizing work of self and others.
  • Assume ownership of projects and new product development.
Job Requirements

Experience & Skills

  • MS or PhD in Mechanical Engineering, Physics, Materials Science, Electrical Engineering, or Optical Engineering preferred, or equivalent experience required
  • Minimum 5 years as an individual contributor in industry and/or government laboratories (10+ years preferred). Experience within a fast-paced, start-up environment a plus.
  • Candidates will be skilled in thermo-mechanical design, material processing, and assembly. Experience in the development of semiconductor-laser or LED related products is preferred.
  • Direct experience in or exposure to high volume manufacturing production.
  • Strong data analysis skills, e.g. with SAS JMP, and familiarity with database structures.
  • Self-motivated, detail-oriented team player with excellent interpersonal and communication skills.
  • Small amount of travel 10% could be needed within USA and overseas (Asia primarily)
  • Experience in these areas is a plus:
    • Surface mount technology, phosphor integration technology, LED lighting, lead frame design, automotive LED assembly, hermetic package design
    • Die attach, die bonding, solder systems, pick & place, wire bonding, fluid dispense, sealing
    • Optoelectronic testing, integrating sphere
    • Material development, ceramic materials, high temperature materials
    • Device fabrication, chip scale package, wafer bonding, dicing, III-V wide band gap devices, GaN devices, device architecture
    • Prototyping
    • Data analysis and statistics, LED package thermal simulation, Computational Fluid Dynamics (CFD), SolidWorks
    • Project management

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