Teledyne Scientific & Imaging is composed of two business units: Teledyne Scientific Company and Teledyne Imaging Sensors. Teledyne Scientific Company (TSC) is focused on leading-edge R&D and niche products. The Electronics Division develops high speed electronics, MEMS sensors and actuators, and compound semiconductors. The Materials & Optics Division covers a broad range of R&D, including ceramic composites for next-generation rocket nozzles, energy harvesting technologies, electronic device packaging, biomaterials, and liquid crystal-based optical devices. The Information Sciences Division has key areas of expertise in autonomous systems, image and sensor processing, sensor and information fusion, resource allocation and planning, computational fluid dynamics, control and power systems, and wireless networking and network security. TSC produces a steady stream of intellectual property, software, and new products, which find application in high-impact government and commercial applications. Teledyne Imaging Sensors (TIS) is primarily engaged in the design, development and production of high performance infrared and visible sensor subsystems used in space missions, long range terrestrial surveillance and targeting and astronomy applications. Two of TISÆs largest customers are NASA, for whom we are developing sensors on the James Webb Space Telescope, and the Army, for whom we are developing ôthird generationö infrared tactical imaging systems that will be fielded later this decade. TIS also has developed and is manufacturing laser eye protection spectacles, whose initial application is to protect military pilots.
Responsible for system level integration of high performance sensor systems. Provide systems engineering solutions for new and ongoing programs within the Imaging organization, focusing on focal plane array-driven system designs.
Essential Duties and Responsibilities include the following. Other duties may be assigned.
Provides system level engineering analysis and is responsible for requirements flow-down and works with lead engineers in technical disciplines to optimize system architecture, so as to fabricate, test and deliver products that fully meet all customer requirements
Assess system level engineering issues, performing cost/benefit trade-offs and optimizing system architecture
Prepare for and conduct design reviews and technical interactions with customers
Work collaboratively with teams of highly skilled engineers from various disciplines such as IC design, electronics, software, firmware, mechanical engineering, detector fabrication and semiconductor test
Responsible for system level integration of high performance focal plane array and camera systems, for visible and infrared imaging applications
Fully own and deliver artifacts for system level engineering analysis, system architecture development, requirements flow-down, interface management, configuration baseline maintenance, structured decisions and risk management
Lead subsystem engineers in technical disciplines to optimize system architecture, so as to fabricate, test, and deliver products that fully meet all customer requirements
Understand end application and flow-down customers’ instrumentation requirements
Work with other system engineers to develop and implement a rigorous systems engineering process; work with program management to continuously improve engineering processes within Teledyne Imaging Sensors
Work with business development staff on proposals and program capture activities
Generate technical ideas for new products and technologies
Qualifications & Competencies
To perform the job successfully, an individual should demonstrate the following qualifications and competencies:
Strong knowledge of electronics, solid state physics, laboratory equipment, cryogenic systems and measurement techniques
- System Engineering principles and practice
- Familiarity with Program Management techniques and tools
- Must have intimate knowledge of few of the following technical disciplines, including CMOS design, electronics, detector materials, mechanical engineering, packaging, cryogenics, optics, firmware, software, sensor tes
- Excellent oral and written communication skills
- Excellent organizational skill
- Ability to handle complex problem
- Ability to multi-task among multiple project
- Proven leadership skills with strong communication and teamwork skills
- Fluency with Microsoft Office products, including Word, Excel and Project
- Displays exemplary ethics and business conduct and performs work cognizant of safe work practices
Education and/or Experience
Bachelor’s Degree in EE, Physics, or other engineering discipline with fifteen (15) years of experience, Master’s Degree with ten (10) years of experience or PhD with five (5) years of experience
Project management experience required
Ten (10) plus years of experience with sensor systems
- This position requires an active security clearance.
Teledyne is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, gender, sexual orientation, gender identity, gender expression, transgender, pregnancy, marital status, national origin, ancestry, citizenship status, age, disability, protected Veteran Status, genetics or any other characteristic protected by applicable federal, state, or local law.
If you need assistance or an accommodation while seeking employment, please email [email protected] or call (805)373-4545. Determinations on requests for reasonable accommodation will be made on a case-by-case basis. Please note that only those inquiries concerning a request for reasonable accommodation will receive a response.
Apply Here: https://spiecareercenter.org/jobs/5371013