Sr. OSA Process Engineer – Finisar – Fremont, CA

• Develop new assembly processes from earliest concept thru production ramp. Lead the process development including identification of materials as well as specification of automation and assembly equipment
• Active member of new-product introduction team, collaborating with other design engineers, logistics, and quality engineering to develop process documentation, process control plans, and production control requirements to ensure the effective and efficient shipment of electronic components in high volume to our customers
• Provide critical feedback to the NPI team on the manufacturability of the new product by providing/coordinating appropriate DFM reviews. Analyze process capability including design-of-experiments to characterize processes and ensure high quality and high yields
• Evaluate and establish process capability and take responsibility for assembly yield during the development phase
• Provide the required process and equipment training for operators, technicians and offshore personnel as products transfer to production
• Coordinate design and fabrication of process tooling fixtures
• Work with sub-contractors to ensure their processes meet our design requirements, committing to development schedules, and meeting project milestones
• Travel to interact with overseas production facilities (Malaysia and China)

SKILLS/QUALIFICATIONS:
The ideal candidate will have demonstrated ability in the following areas:

• Minimum five years of relevant experience in assembly process development for microelectronic, optoelectronic and fiber-optics components and assemblies
• Expertise on active/passive optical components/devices, silicon photonics and assembly/packaging process and technologies
• Ph.D. in Opto-electronics, or other engineering field is required.

Skills

• Strong interpersonal/team skills, able to communicate and effectively interact with other engineers, supervisors, assembly operators, maintenance, etc. Excellent communication, planning, organizational, and interpersonal skills.
• Proficient with Six Sigma methodology/tools such as Root Cause Analysis, SPC, FMEA, Control Plans, and Design of Experiments
• Familiar with passive and active components alignment, Knowledge of opto-electronic packaging design and assembly
• Hands-on experience and knowledge with various SMT and Flip Chip assembly equipment and processes such as auto epoxy dispensing, auto high accuracy die bonding and active alignment, etc.
• Excellent analytical & problem-solving skills.
• Knowledge of SolidWorks mechanical design and DOE software is preferred.
• Expertise in the development/operation of production tooling and fixtures, and in the use of standard lab tools and metrology equipment.