Who We Are:
Elenion Technologies is driving
innovation in silicon photonics, an emerging technology poised to significantly
increase performance and reduce costs of optical systems. We are headquartered
in New York City, with offices in San Jose, California and Munich, Germany.
After pursuing a path of
intensely focused research and development for two years in stealth-mode,
Elenion recently unveiled itself to the world and has assembled a world-class
team of multi-disciplinary experts. Members of our leadership team have built
and sold several companies, published papers in the top scientific journals in
the world, raised hundreds of millions of dollars of venture capital, and have
built products and deployed them to the market.
The technical team includes world leaders in our space, and many
members are PhD scientists and engineers from the top schools in the world,
such as MIT, Caltech, UChicago, and Columbia.
Elenion is developing
next-generation photonic integrated circuit technologies and solutions for a
broad range of datacom and telecom applications. It is almost certain that, as
you read this web page, the data traveling from the server to your computer or
phone went through hardware that someone on our team designed, built, or deployed.
This team builds the hardware at
the heart of the internet. We think that’s cool. Hopefully, you do too.
The Position:
We are searching for a highly skilled Optoelectronics
Packaging Engineer with particularly strong expertise in thermal and stress
analysis. Based out of our New York City office, the Packaging Engineer will develop
module packaging and assembly processes, in close collaboration with the
photonics design team, the PCB/module team, and our contract manufacturer (CM).
The ideal candidate for this role is
self-directed and independent, driven to solve problems, and inclined to thrive
in a fast-paced, dynamic start-up environment.
Key Responsibilities:
·
Perform
thermal and stress analyses of subassembly and module designs.
·
Collaborate
with our CM on the development of packaging and assembly processes.
·
Design
and experiment for packaging reliability, and perform Failure Mode Engineering
Analysis (FMEA).
·
Oversee
the development and qualification of packaging materials.
·
Collaborate
with the photonics design team to optimize performance, reliability and
manufacturability, within constraints.
Key Qualifications:
·
Bachelor’s
degree + 10 years’ industry experience; MS + 5 years; or PhD + 3 years.
·
At
least 5 years’ industry experience in thermal and stress simulation coupled
with a deep understanding of thermal and stress issues and solutions.
·
At
least 5 years’ experience with optical systems.
·
Proven
track record of package and process design and development, from design to
production.
·
Strong
FEA skills; experience with tools such as Abaqus or ANSYS.
·
Experience
with SolidWorks.
·
Excellent
interpersonal and communication skills.
Additional Assets:
·
Experience
with integrated optics.
·
Experience
with high-speed electronics package design and/or laser package design.
·
Experience
with design for manufacturing, 2.5D/3D packaging, and TSVs.
Compensation:
Competitive salary and full range of benefits
Travel: Up to 20%
We are an Equal Opportunity Employer and do not
discriminate against any employee or applicant for employment because of race,
color, sex, age, national origin, religion, sexual orientation, gender
identity, status as a veteran, and basis of disability or any other federal,
state or local protected class.