Location: Rochester, NY
Category: Professional
Posted On: Thu Mar 2 2017
Job Description:
The 3D technology integration engineer responsibility will entail completing 2.5D/3D photonic packages fabricated at SUNY Poly by providing system level packaged solutions developed and fabricated at our Rochester AIM test assembly and packaging facility
This position is to be filled with an applicant that can collaborate with a cross-functional multi-diverse team that will encompass system design, silicon photonics fabrication and 3D integration while providing package assembly and test solutions to AIM Photonics customers.
Specifically, the applicant will be responsible to work with the silicon photonics team at SUNY Poly in Albany to develop packaging prototypes leading to small volume manufacturing at the Rochester packaging facility. The applicant should have a working knowledge of organic and Silicon packaging as well as solder systems used for chip scale packaging. The 3D packaging engineer should be able to develop state of the art packaging solutions that are cost effective and advance photonic packaging technology.
The applicant will have responsibility for the device specifications of photonic integrated devices, assisting characterization, verification, and qualification of the photonic devices within the technology. Experience related to packaging of 3D integrated technology is highly desired. The applicant should have a working knowledge of solder systems, plating technology, underfill/overmold technology and classical laminate packages.
The applicant should also have the ability to build full integrated routes with preferred experience in SiVIEW.
Other reasonable duties as assigned
Job Requirements:
B.S. degree in Chemical Engineering, Materials Science, Electrical Engineering, or equivalent Engineering and/or Science discipline from a college or University accredited by the US Department of Educationor internationally recognized accrediting organization AND 1-5 years of relevant professional industry experience.
OR M.S. degree in Chemical Engineering, Materials Science, Electrical Engineering, or equivalent Engineering and/or Science discipline from a college or University accredited by the US Department of Education or internationally recognized accrediting organization AND 1-5 years of relevant professional industry experience.
OR Ph.D in Chemical Engineering, Materials Science, Electrical Engineering, or equivalent Engineering and/or Science discipline from a college or University accredited by the US Department of Education or internationally recognized accrediting organization AND 1-3 years of relevant professional industry experience.
Prior experience with fab logistics software (SiView preferred) is recommend but not require. Candidate will need to work in a diverse consortia environment where new photonics elements will be developed and packaging manufacturing are being developed for low cost solutions.
The ability to work well with engineers and scientists is an essential trait. Ability to work well under pressure and in a fast-paced environment is a must. Candidate must exhibit solid leadership ability and be willing to execute a variety of tasks on short notice.
Preferred Qualifications:
A working knowledge of silicon photonics is desirable.
Applicants must address in their applications their abilities to work with a culturally diverse population. This position is contingent on the satisfactory completion of a background check; this position may require annual background checks.
Temporary assignment to work in Albany might be required 1- 3 months prior getting tools installed in Rochester.
Notes: Position contingent on the availability of funding