Oclaro, Inc. (Nasdaq: OCLR), is a leader in optical components, modules and subsystems for the core optical, enterprise and data center markets. Leveraging more than three decades of laser technology innovation, photonics integration, and subsystem design, Oclaro’s solutions are at the heart of the fast optical networks and high-speed interconnects driving the next wave of streaming video, cloud computing, voice over IP and other bandwidth-intensive and high-speed applications.
Position Reports to: Director, HW Development Engineering
Location of position: San Jose, California
Oclaro is seeking a Senior Optical Packaging Engineer to join one of the leading optical components and module R&D teams in the world. You will have an opportunity to contribute to the design and testing of transceiver devices that are deployed in data centers, core optical transport, service provider, and wireless backhaul markets. You will design high performance transceiver modules utilized in transmission systems at 100Gb/sec to 400Gb/sec data rates. As the Optical Packaging Engineer you will work within a multi-disciplinary R&D team that designs Oclaro’s next-generation high volume optical transceiver modules (100Gb/s to 400Gb/s). This position will also be responsible for investigating new technologies in support of future transceiver designs.
Drive and develop advanced packaging solution for 100Gb/s to 400 Gb/s modules and sub-assemblies
Optical design simulation, tolerance analysis and characterization
Develop optical alignment processes and performance testing procedures
Develop and validate photonic integration process including flip-chip bonding, epoxy and solder bonding, wire and ribbon bonding, encapsulation, etc.
Interact with both internal and external manufacturers to support new product designs
M.S. or Ph.D in Applied Physics, EE, or Material Science preferred.
Strong experience in optical design simulation and tolerance analysis with Zemax, Rsoft, Matlab, etc.
Familiar with advanced packaging process, material selection and process development, solder alloy selection, metallization stackup on chip and submount, process development and reliability validation.
Extensive experience in fiber optic device package design, thermal engineering, hermetic packaging, fiber alignment, and environmental qualification.
Must be strong in problem solving with excellent communication skills to interact with engineering staff, external vendors and contractors.
All qualified applicants will receive consideration for employment without regard to race, sex, color, religion , sexual orientation, gender identity, national origin, protec ted veteran status, or on the basis of disability