Intel Data Center Group DCG – Silicon Photonics Solution Division SPPD is looking for an opto-mechanical design & packaging engineer in R&D design team. This is a unique opportunity to join a group at the cusp of bleeding edge product and technology development with lots of growth and exciting opportunities – the primary job responsibility includes but not limited to: – Lead or support as a part of team in developing packaging design for state of the art Silicon Photonics SiPh devices and assemblies, with emphasis on optoelectronic and microelectronic component and sub-systems- Drive or lead package designs and technology selection Assess and mitigate risks associated with the product designs- Partner with stakeholders to identify new suppliers for design, develop and manage existing suppliers Interacting with suppliers and optimize designs based on supplier’s processes and capabilities- Working with cross-functional groups to determine package requirements. Design from concept to volume production to meet the electrical, optical, mechanical , thermal, and reliability requirements- Perform tolerance analysis of opto-mechanical components and subassemblies- Perform thermal and mechanical Finite Element Analysis FEA analysis of packages and subassemblies, to determine temperature profiles, power dissipation and mechanical stress over temperature etc…- Lead or support developing assembly and test method to validate the design- Generating opto-mechanical component drawings, layouts, assembly drawings for product and tooling- Work with Manufacturing Ops team on managing and developing the full Bill of Materials BOM and analyse data and optimize yield
The candidate under consideration should be meeting the following qualifications:
Minimum 2~3 years of experience in the photonics or semiconductor or related industry
Basic understanding of transceiver module assembly processes
Minimum 2~3 years of experience – and expert capability – in 3D design software such as Solidworks
Familiar with enterprise data management system such as ePDM
Fluent user of the following software packages: MS Windows, Excel, Word.
Detail oriented problem solver, sense of urgency and commitment to achieve targeted goals.
Proven track record in product design and development cycle from initial conceptual design to high volume production is highly desirable
Hands-on experience and knowledge with optoelectronic and microelectronic packaging: die-attach, wirebond, leadframe, micro-optics assembly, laser welding, epoxies* Working knowledge and experience in high volume manufacturing fabrication processes including machining, sheet metal stamping, metal /plastic injection molding and die casting
Team player with good communication skills.
Excellent verbal and written communication, interpersonal skill.
Ability to work independently as well as in a team environment across functional and organizational boundaries is required.
Demonstrated ability to juggle multiple priorities and deliver against a schedule
Working knowledge with product documentation, schematics, and Bill of Materials.
Capable and open minded to learn new technology
MS’s degree or advanced degree preferred in related engineering field
Prior design experience in high volume product environment such as optical transceivers, cell phones, disk drives or automation
Experience in product thermal design and knowledgeable on heat sinks, fans and thermal interface materials.
Proficient in ICEPAK and/or FLOTHERM CFD modeling tools.
Experience in FEA structural analysis and knowledgeable on modeling tools such as Abaqus or ANSYS.
Experience and knowledgeable with optical simulation and tools, such as Zemax* Prior experience with optical passive and active alignment
The Data Center Group (DCG) drives new products technologies from high-end co-processors for supercomputers to low-energy systems for enterprise and the cloud, as well as solutions for big data and intelligent devices. The group is a worldwide organization that develops the products and technologies that power nine of every 10 servers sold worldwide. www.intel.com/jobs/datacenter Inside this Business Group
The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.
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