Responsible for identifying and evaluating the optical, electrical and thermal mechanical failures of assembly package to determine failure mode and mechanisms. Conduct hands on lab work using destructive and non-destructive tools/methods, develop innovative FA techniques, recommend corrective actions/fixes to help improve packaging quality and reliability, and support technology transfer to High Volume Manufacturing.
- Master’s degree in Physics, Electrical Engineering, Materials Science, or related field
- Optical, structural and electrical characterization
- Test and measurement instrumentation, for instance: high-speed optical oscilloscopes, waveform generators, optical spectrometers, integrating spheres, light detectors and other basic electrical and optical laboratory equipment
- Experience with photonic devices (Lasers, Photodiodes, isolators, etc.) technologies
- LabView and Pyton programming
- Semiconductor processing and device fabrication
- Ph.D. in Physics, Electrical Engineering, Materials Science, or related field
- Structure and property of Materials
- Non-destructive and Destructive Analytical tool/technique development
- Strong technical background and ability for problem solving
- Good communication and decision making skills
- Strong teamwork and planning/time management skills. Able to deliver under pressure
- Ability to work well in ambiguous situations. Mature, self-assured, well organized Inside this Business Group
As the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art — from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
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