- Developing state of the art Silicon Photonics (SiPh) devices and assemblies; * Working with mechanical, electrical, optical, test engineers to determine process requirements and define process capabilities; * Leading hands-on development of die attach and assembly processes using micron level pick and place machines for next-generation transceiver products * Developing technical expertise on micron level pick/place and alignment machines; * Performing characterization and failure analysis on next-generation SiPh devices and assemblies; * Development of automated optical alignment equipment and processes for Silicon Photonics devices; * Interacting with and travelling to CMs to transfer processes and equipment to a production line; * Travelling to vendors for equipment evaluation and buy-off; * Leading reviews of process development activities;
- Minimum 6 years of process experience (8 or more is preferred) in process development (photonics or semiconductor is preferred) using micron level pick and place machines; * In depth understanding of assembly processes such as die bonding, wire bonding, epoxying, optical alignment etc. * Excellent verbal and written communication, interpersonal skill. Detail oriented problem solver, sense of urgency and commitment to achieve targeted goals. * Ability to work independently with limited direction, as well as in a team environment across functional and organizational boundaries is required. * Demonstrated ability to juggle multiple priorities and deliver against a schedule; * Experience in SiPh assembly processes and design rules is a plus; * Proficiency in JMP or statistical analysis tool is a plus; * Team player with good communication skills. Strong technical leadership skills are a plus. * Proven experience in executing complex projects that require cross-functional teamwork is preferred; * Bachelor’s degree (advanced degree preferred) in related engineering field; Inside this Business Group
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