Research Scientist

I am currently seeking a Research Scientist with a background in algorithm development, data translation, and scientific programming. Experience with parallel computing, mastery of a programming language, and familiarity with remote sensors are preferred. You’ll be working closely with the algorithm engineers and be tasked with translating data into useable solutions. A BS or MS…

Regional Sales Engineer – Bitplane (Home Based) – Oxford Instruments plc

We have an exceptional opportunity for a Regional Sales Engineer who will develop new business for Bitplane’s Imaris 3D/4D advanced image analysis software by providing information on the product and solutions to customers’ key endpoints. This is an ideal position for a biological scientist or an engineer (B.Sc./B.Eng. minimum, Ph.D. and or M.Sc. desired) who…

Optical Test Engineer – Intel

Job Description As an Optical Test Engineer, you will be responsible for testing of various optical and photonic components and subsystems for Intel’s next generation high-speed silicon photonic products. You will work closely with component and module design engineers for component characterization, optical sub-assembly testing, and data analytics. You are also expected to assist the…

Thin Film Engineer

The Photonics GroupRespond with resume to dab@photonicsgrp.com SUMMARY We are seeking an Optical Thin Film Engineer with detailed knowledge of optical coating and thin film deposition. This includes thin film design, process improvement and knowledge of product applications. RESPONSIBILITIES INCLUDE Develop and design optical coatings. Transfer into production. Recommend and develop process improvements in production Work with production in resolving manufacturing issues. Upgrade current…

Senior Optical Asssembly Process Development Engineer – Intel

Job Description Developing state of the art Silicon Photonics (SiPh) devices and assemblies; * Working with mechanical, electrical, optical, test engineers to determine process requirements and define process capabilities; * Leading hands-on development of die attach and assembly processes using micron level pick and place machines for next-generation transceiver products * Developing technical expertise on…